Effect of Interfacial Chemistry on Electrical Reliability of Copper-filled Electrically Conductive Adhesives

被引：0
|
作者：
Otajima, Daisuke [1 ]
Matsunami, Yukari [1 ]
Inoue, Masahiro [1 ]
机构：
[1] Gunma Univ, Grad Sch Sci & Technol, Ota, Japan
来源：
2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022) | 2022年
关键词：
electrically conductive adhesives; copper fillers; surface treatment agents; electrical conductivity; environmental test;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
To investigate the effect of surface treatment agents on electrical resistivity in an 85 degrees C/85%RH environment, copper (Cu) fillers surface-treated with oleic acid and triethanolamine were mixed with a resol-type phenolic resin to obtain the conductive adhesives. When the cured samples were exposed to 85 degrees C/85%RH, the electrical resistivity increased significantly when oleic acid and triethanolamine were individually used for the surface treatment of the fillers. However, the increase in resistivity was greatly suppressed when these surfactants were simultaneously used for the surface treatment. This suggests that interfacial chemistry is a key for designing advanced Cu-filled adhesives.
引用
收藏
页码：233 / 234
页数：2
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