Influence of high power impulse magnetron sputtering plasma ionization on the microstructure of TiN thin films

被引:109
|
作者
Ehiasarian, A. P. [1 ]
Vetushka, A. [1 ]
Gonzalvo, Y. Aranda [2 ]
Safran, G. [3 ]
Szekely, L. [3 ]
Barna, P. B. [3 ]
机构
[1] Sheffield Hallam Univ, Nanotechnol Ctr PVD Res, Mat & Engn Inst, Howard St, Sheffield S1 1WB, S Yorkshire, England
[2] Hiden Analyt Ltd, Plasma & Surface Div, Warrington WA5 7UN, Cheshire, England
[3] Res Inst Tech Phys & Mat Sci, H-1525 Budapest, Hungary
基金
英国工程与自然科学研究理事会;
关键词
PREFERRED ORIENTATION; ENERGY-DISTRIBUTION; SURFACE-MORPHOLOGY; STRESS GENERATION; GROWTH; OXYGEN; LAYERS; DEPOSITION; DENSITIES; TIN(111);
D O I
10.1063/1.3579443
中图分类号
O59 [应用物理学];
学科分类号
摘要
HIPIMS (High Power Impulse Magnetron Sputtering) discharge is a new PVD technology for the deposition of high-quality thin films. The deposition flux contains a high degree of metal ionization and nitrogen dissociation. The microstructure of HIPIMS-deposited nitride films is denser compared to conventional sputter technologies. However, the mechanisms acting on the microstructure, texture and properties have not been discussed in detail so far. In this study, the growth of TIN by HIPIMS of Ti in mixed Ar and N-2 atmosphere has been investigated. Varying degrees of metal ionization and nitrogen dissociation were produced by increasing the peak discharge current (I-d) from 5 to 30 A. The average power was maintained constant by adjusting the frequency. Mass spectrometry measurements of the deposition flux revealed a high content of ionized film-forming species, such as Ti1+, Ti2+ and atomic nitrogen N1+. Ti1+ ions with energies up to 50 eV were detected during the pulse with reducing energy in the pulse-off times. Langmuir probe measurements showed that the peak plasma density during the pulse was 3 x 10(16) m(-3). Plasma density, and ion flux ratios of N1+ : N-2(1+) and Ti1+:Ti-0 increased linearly with peak current. The ratios exceeded 1 at 30 A. TIN films deposited by HIRIMS were analyzed by X-ray diffraction, and transmission electron microscopy. At high I-d, N1+:N-2(1+) > 1 and Ti1+:Ti-0 > 1 were produced; a strong 002 texture was present and column boundaries in the films were atomically tight. As I-d reduced and N1+: N-2(1+) and Ti1+:Ti-0 dropped below 1, the film texture switched to strong 111 with a dense structure. At very low I-d, porosity between columns developed. The effects of the significant activation of the deposition flux observed in the HIPIMS discharge on the film texture, microstructure, morphology and properties are discussed. (C) 2011 American Institute of Physics. [doi :10.1063/1.3579443]
引用
收藏
页数:15
相关论文
共 50 条
  • [41] Plasma potential mapping of high power impulse magnetron sputtering discharges
    Rauch, Albert
    Mendelsberg, Rueben J.
    Sanders, Jason M.
    Anders, Andre
    JOURNAL OF APPLIED PHYSICS, 2012, 111 (08)
  • [42] Optimization of superconducting niobium nitride thin films via high-power impulse magnetron sputtering
    Horne, Hudson T.
    Hugo, Collin M.
    Reid, Brandon C.
    Santavicca, Daniel F.
    SUPERCONDUCTOR SCIENCE & TECHNOLOGY, 2024, 37 (12):
  • [43] Deposition of diamond-like carbon thin films by the high power impulse magnetron sputtering method
    Wiatrowski, A.
    Kijaszek, W.
    Posadowski, W. M.
    Oleszkiewicz, W.
    Jadczak, J.
    Kunicki, P.
    DIAMOND AND RELATED MATERIALS, 2017, 72 : 71 - 76
  • [44] Rutile TiO2 thin films grown by reactive high power impulse magnetron sputtering
    Agnarsson, B.
    Magnus, F.
    Tryggvason, T. K.
    Ingason, A. S.
    Leosson, K.
    Olafsson, S.
    Gudmundsson, J. T.
    THIN SOLID FILMS, 2013, 545 : 445 - 450
  • [45] Thermal stability of MoNbTaTiW, MoNbTaVW and CrMoNbTaW thin films deposited by high power impulse magnetron sputtering
    Gruber, Georg C.
    Lassnig, Alice
    Zak, Stanislav
    Gammer, Christoph
    Cordill, Megan J.
    Franz, Robert
    SURFACE & COATINGS TECHNOLOGY, 2023, 454
  • [46] Energy-enhanced deposition of copper thin films by bipolar high power impulse magnetron sputtering
    Velicu, Ioana-Laura
    Ianos, Gabriela-Theodora
    Porosnicu, Corneliu
    Mihaila, Ilarion
    Burducea, Ion
    Velea, Alin
    Cristea, Daniel
    Munteanu, Daniel
    Tiron, Vasile
    SURFACE & COATINGS TECHNOLOGY, 2019, 359 (97-107): : 97 - 107
  • [47] Study of Cobalt Mononitride Thin Films Prepared Using DC and High Power Impulse Magnetron Sputtering
    Gupta, Rachana
    Pandey, Nidhi
    Behera, Layanta
    Gupta, Mukul
    DAE SOLID STATE PHYSICS SYMPOSIUM 2015, 2016, 1731
  • [48] Interface microstructure engineering by high power impulse magnetron sputtering for the enhancement of adhesion
    Ehiasarian, A. P.
    Wen, J. G.
    Petrov, I.
    JOURNAL OF APPLIED PHYSICS, 2007, 101 (05)
  • [49] Interface microstructure engineering by high power impulse magnetron sputtering for the enhancement of adhesion
    Materials and Engineering Research Institute, Sheffield Hallam University, Howard Street, Sheffield S1 1WB, United Kingdom
    Journal of Applied Physics, 2007, 101 (05):
  • [50] Deposition of thin TiN films by low-power reactive magnetron sputtering
    Mikhal'chuk, P.V.
    Orlikovsky, A.A.
    Vasiliev, A.G.
    Lebedev, O.I.
    Zakharov, D.N.
    Vide: Science, Technique et Applications, 1997, 53 (283 SUPPL.): : 143 - 145