A two-dimensional (2D) analytical subthreshold swing and transconductance model of underlap dual-material double-gate (DMDG) MOSFET for analog/RF applications

被引:14
|
作者
Narendar, Vadthiya [1 ]
Rai, Saurabh [1 ]
Tiwari, Siddharth [1 ]
Mishra, R. A. [1 ]
机构
[1] Motilal Nehru Natl Inst Technol, Dept Elect & Commun Engn, Allahabad 211004, Uttar Pradesh, India
关键词
Analog/RF parameters; Dual-metal double-gate (DMDG); Short channel effects (SCEs); Subthreshold swing (SS); Transconductance (g(m)); Underlap; SOI; DESIGN; PERFORMANCE; IMPACT;
D O I
10.1016/j.spmi.2016.09.028
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
The double-gate (DG) metal-oxide-semiconductor field effect transistors (MOSFETs) are the choice of technology in sub - 100 nm regime of leading microelectronics industry. To enhance the analog and RF performance of DG MOSFET, an underlap dual-material (DM) DG MOSFET device structure has been considered because, it has the advantages of both underlap as well as that of dual-material gate (DMG). A 2D analytical surface potential, subthreshold current, subthreshold swing as well as transconductance modelling of underlap DMDG MOSFET has been done by solving the Poisson's equation. It has also been found that, numerically simulated data approves the analytically modelled data with commendable accuracy. As underlap length (L-un) increases, a substantial reduction of subthreshold current due to enhanced gate control over channel regime is observed. DMG structure facilitates to improve the average velocity of carriers which leads to superior drive current of the device. The underlap DMDG MOSFET device structure demonstrates an ameliorated subthreshold characteristic. The analog figure of merits (FOMs) such as transconductance (g(m)), transconductance generation factor (TGF), output conductance (g(d)), early voltage (V-EA), intrinsic gain (A(V)) and RF FOMs namely cut-off frequency (f(T)), gain frequency product (GFP), transconductance frequency product (TFP) and gain transconductance frequency product (GTFP) have been evaluated. The aforesaid analysis revels that, the device is best suited for communication related Analog/RF applications. (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码:274 / 289
页数:16
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