共 50 条
- [41] High speed voltage follower for standard BiCMOS technology IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-ANALOG AND DIGITAL SIGNAL PROCESSING, 2001, 48 (07): : 727 - 732
- [42] Manufacturability of SiGe:C and Si epitaxy for heterojunction bipolar transistors integrated in a BiCMOS technology RAPID THERMAL AND OTHER SHORT-TIME PROCESSING TECHNOLOGIES III, PROCEEDINGS, 2002, 2002 (11): : 73 - 79
- [43] Bipolar-complementary-metal-oxide-semiconductor (BiCMOS) technology with polysilicon self-aligned bipolar devices Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1991, 30 (10): : 2459 - 2465
- [44] Scalable High Voltage CMOS technology for Smart Power and sensor applications ELEKTROTECHNIK UND INFORMATIONSTECHNIK, 2008, 125 (04): : 109 - 117
- [45] Development of a High Voltage Deep Trench Environment for a Smart Power Technology EPE: 2009 13TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS, VOLS 1-9, 2009, : 996 - 1004
- [46] A complementary BiCMOS technology with high speed npn and pnp SiGe:: CHBTs 2003 IEEE INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST, 2003, : 117 - 120
- [48] A Low-Power VCSEL Driver in a Complementary SiGe: C BiCMOS Technology 2018 IEEE 18TH TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS (SIRF), 2018, : 45 - 47
- [49] BIPOLAR-COMPLEMENTARY-METAL-OXIDE-SEMICONDUCTOR (BICMOS) TECHNOLOGY WITH POLYSILICON SELF-ALIGNED BIPOLAR-DEVICES JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1991, 30 (10): : 2459 - 2465
- [50] Silicon direct bonding approach to high voltage power device (insulated gate bipolar transistors) ADVANCES IN MICROELECTRONIC DEVICE TECHNOLOGY, 2001, 4600 : 88 - 95