HIGH TEMPERATURE SENSOR BASED ON SiC SCHOTTKY DIODES WITH UNDOPED OXIDE RAMP TERMINATION

被引:0
|
作者
Pascu, R. [1 ]
Draghici, F. [1 ,2 ]
Badila, M. [3 ]
Craciunoiu, F. [1 ]
Brezeanu, G. [2 ]
Dinescu, A. [1 ]
Rusu, I. [2 ]
机构
[1] IMT Bucharest, Natl Inst Res & Dev Microtechnol, Erou Iancu Nicolae 126A 32B, Bucharest 077190, Romania
[2] Univ Bucharest, Bucharest, Romania
[3] ON Semicond Corp, Phoenix, AZ USA
关键词
high temperature sensors; silicon carbide (SiC); oxide ramp termination; packaging;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A simple technology of 4H-SiC Schottky diode with oxide ramp termination is presented. The ramp is controlled by two undoped layers: an annealed (compact) oxide layer and as deposited layer, respectively.
引用
收藏
页码:379 / 382
页数:4
相关论文
共 50 条
  • [41] A High Frequency (HF) Inductive Power Transfer Circuit for High Temperature Applications Using SiC Schottky Diodes
    Jordan, Jennifer L.
    Ponchak, George E.
    Spry, David J.
    Neudeck, Philip G.
    2018 IEEE TOPICAL CONFERENCE ON WIRELESS SENSORS AND SENSOR NETWORKS (WISNET), 2018, : 23 - 26
  • [42] Lateral current spreading in SiC Schottky diodes using field-prate edge termination
    Zhang, Q
    Madangarli, V
    Tarplee, M
    Sudarshan, TS
    SILICON CARBIDE AND RELATED MATERIALS - 1999 PTS, 1 & 2, 2000, 338-3 : 1223 - 1226
  • [43] Lateral current spreading in SiC Schottky diodes using field-plate edge termination
    Zhang, Q.
    Madangarli, V.
    Tarplee, M.
    Sudarshan, T.S.
    Materials Science Forum, 2000, 338
  • [44] Medici simulation of 6H-SiC oxide ramp profile Schottky structure
    Brezeanu, G
    Fernandez, J
    Millan, J
    Badila, M
    Dilimot, G
    SILICON CARBIDE, III-NITRIDES AND RELATED MATERIALS, PTS 1 AND 2, 1998, 264-2 : 941 - 944
  • [45] Temperature effects on the ruggedness of SiC Schottky diodes under surge current
    Leon, J.
    Perpina, X.
    Banu, V.
    Montserrat, J.
    Berthou, M.
    Vellvehi, M.
    Godignon, P.
    Jorda, X.
    MICROELECTRONICS RELIABILITY, 2014, 54 (9-10) : 2207 - 2212
  • [46] Influence of Packaging Processes and Temperature on Characteristics of Schottky Diodes Made of SiC
    Gorecki, Pawel
    Mysliwiec, Marcin
    Gorecki, Krzysztof
    Kisiel, Ryszard
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (04): : 633 - 641
  • [47] High performance Schottky diodes based on indium-gallium-zinc-oxide
    Zhang, Jiawei
    Xin, Qian
    Song, Aimin
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2016, 34 (04):
  • [48] Temperature Dependence of 4H-SiC JBS and Schottky Diodes after High Temperature Treatment of Contact Metal
    Pérez, R
    Mestres, N
    Tournier, D
    Jordà, X
    Vellvehí, M
    Godignon, P
    SILICON CARBIDE AND RELATED MATERIALS 2004, 2005, 483 : 945 - 948
  • [49] DESIGN OF QUASI-VERTICAL GaN HIGH POWER SCHOTTKY DIODES BASED ON FIELD PLATE TERMINATION
    Sundaramoorthy, Vinoth
    Nistor, Iulian
    2010 INTERNATIONAL SEMICONDUCTOR CONFERENCE (CAS), VOLS 1 AND 2, 2010, : 401 - 404
  • [50] Simulation and fabrication of high voltage AlGaN/GaN based Schottky diodes with field plate edge termination
    Remashan, K.
    Huang, Wen-Pin
    Chyi, Jen-Inn
    MICROELECTRONIC ENGINEERING, 2007, 84 (12) : 2907 - 2915