Fatigue crack propagation analysis for micro solder joints with void

被引：0
|
作者：
Terasaki, Takeshi [1 ]
Tanie, Hisashi [1 ]
机构：
[1] Hitachi Ltd, Mech Engn Res Lab, Hitachi, Ibaraki 3120034, Japan
来源：
EMAP 2005: INTERNATIONAL SYMPOSIUM ON ELECTRONICS MATERIALS AND PACKAGING | 2005年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Voids in a solder joint can reduce their fatigue life. Voids are caused by the presence of flux in solder paste during reflow soldering, and they are difficult to remove completely. From numerical analysis, we aimed to obtain criteria for evaluating the effect of voids on fatigue life in a solder joint. We investigated crack propagation in the micro-solder joints of a semiconductor and developed a new crack propagation model. In our model, the fatigue life of a solder joint is evaluated based on damage that is accumulated during crack propagation, and crack paths are automatically calculated. The crack-propagation behavior of a center-cracked-plate (CCP) specimen calculated using the new model agreed well with that obtained from measurement. Using our model, we analyzed the effect of positions and sizes of voids on crack paths and the fatigue life of a ball grid array (BGA) structure. The crack paths and the fatigue life were both found to strongly depend on the positions and sizes of voids. We have achieved a reliable method of evaluating the effects of voids in a solder joint.
引用
收藏
页码：37 / 42
页数：6
相关论文
共 50 条
  • [21] A Study of Crack Propagation in Pb-Free Solder Joints
    Caers, J. F. J. M.
    Zhao, X. J.
    Wong, E. H.
    Seah, S. K. W.
    Selvanayagam, C. S.
    van Driel, W. D.
    Owens, N.
    Leoni, M.
    Tan, L. C.
    Eu, P. L.
    Lai, Yi-Shao
    Yeh, Chang-Lin
    [J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2010, 33 (02): : 84 - 90
  • [22] Transgranular Crack Propagation in Thermal Cycling of SnAgCu Solder Joints
    Lovberg, Andreas
    Tegehall, Per-Erik
    [J]. 2019 20TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2019,
  • [23] Numerical simulation of fatigue crack growth in microelectronics solder joints
    Kaminishi, K
    Iino, M
    Bessho, H
    Taneda, M
    [J]. CMES-COMPUTER MODELING IN ENGINEERING & SCIENCES, 2000, 1 (01): : 107 - 110
  • [24] Fatigue crack growth in lead-free solder joints
    Omiya, Masaki
    Kishimoto, Kikuo
    Anagni, Masazurni
    [J]. EMAP 2005: International Symposium on Electronics Materials and Packaging, 2005, : 232 - 237
  • [25] An empirical crack propagation model and its applications for solder joints
    Hu, JM
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 1996, 118 (02) : 104 - 107
  • [26] Prediction of the fatigue crack growth life in microelectronics solder joints
    Kaminishi, K
    [J]. MATHEMATICAL MODELING AND NUMERICAL SIMULATION IN CONTINUUM MECHANICS, 2002, 19 : 23 - 38
  • [27] Fracture life evaluation of solder joints in semiconductor structures using crack propagation analysis
    Tanie, Hisashi
    Terasaki, Takeshi
    [J]. Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A, 2007, 73 (03): : 372 - 378
  • [28] Modeling and analysis of crack growth in SnPb and SnAgCu solder joints in PBG packages: Part II - Crack propagation
    Kim, DY
    Mawer, A
    Masada, GY
    Moon, TJ
    [J]. ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003, 2003, : 515 - 521
  • [29] New thermal fatigue life prediction method for BGA/FBGA solder joints with basic crack propagation study
    Uegai, Y
    Kawazu, A
    Wu, Q
    Matsushima, H
    Yasunaga, M
    Shimamoto, H
    [J]. 52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1291 - 1296
  • [30] Fatigue crack propagation of laser welded butt joints
    Minagi, A
    Tokaji, K
    [J]. TETSU TO HAGANE-JOURNAL OF THE IRON AND STEEL INSTITUTE OF JAPAN, 2000, 86 (01): : 51 - 56
12345