Efficient modelling of substrate noise and coupling in mixed-signal SPICE designs

被引:7
|
作者
Singh, R
Sali, S
机构
[1] Dept. of Elec. and Electron. Eng., University of Newcastle-upon-Tyne, NE1 7RU, Merz Court
关键词
mixed analogue-digital integrated circuit; SPICE;
D O I
10.1049/el:19970388
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Substrate noise in realistically large mixed-signal SPICE designs is in most cases impossible to model directly, owing to inherent instabilities. It is proposed that by modelling only the critical areas of the circuit, fast efficient analysis of the substrate noise and its coupling effect on the analogue sections can be performed.
引用
收藏
页码:590 / 592
页数:3
相关论文
共 50 条
  • [31] Simulation and measurement of supply and substrate noise in mixed-signal ICs
    Owens, BE
    Adluri, S
    Birrer, P
    Shreeve, R
    Arunachalam, SK
    Mayaram, K
    Fiez, TS
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2005, 40 (02) : 382 - 391
  • [32] Estimation and suppression of substrate noise in mixed-signal integrated circuits
    Kumar, G
    Proceedings of the IEEE INDICON 2004, 2004, : 542 - 545
  • [33] Substrate noise-aware floorplanning for mixed-signal SOCs
    Jeske, M
    Blakiewicz, G
    Chrzanowska-Jeske, M
    Wang, B
    2004 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL 2, PROCEEDINGS, 2004, : 445 - 448
  • [34] Evaluation of active cancellation of substrate noise in mixed-signal ICs
    Baghchehsaraei, Zargham
    Kristiansson, Simon
    Ingvarson, Fredrik
    Jeppson, Kjell O.
    2007 NORCHIP, 2007, : 162 - 165
  • [35] Substrate noise rejection in a new mixed-signal integration technology
    Sharifi, H.
    Mohammadi, S.
    2008 IEEE TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS, DIGEST OF PAPERS, 2008, : 147 - +
  • [36] Mixed-signal simulator speeds past Spice
    Lipman, J
    EDN, 1999, 44 (15) : 18 - 18
  • [37] SPICE PACKAGE SIMULATES MIXED-SIGNAL CIRCUITS
    CONRAD, A
    MICROWAVES & RF, 1993, 32 (06) : 143 - 143
  • [38] Placement of substrate contacts to minimize substrate noise in mixed-signal integrated circuits
    Secareanu, RM
    Warner, S
    Seabridge, S
    Burke, C
    Watrobski, TE
    Morton, C
    Staub, W
    Tellier, T
    Friedman, EG
    ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2001, 28 (03) : 253 - 264
  • [39] An efficient analytical technique for fast and accurate modeling of substrate coupling in mixed-signal IC's
    Moradzadeh, H.
    Karimi, Gh. R.
    10TH IEEE INTERNATIONAL MULTITOPIC CONFERENCE 2006, PROCEEDINGS, 2006, : 494 - +
  • [40] Placement of Substrate Contacts to Minimize Substrate Noise in Mixed-Signal Integrated Circuits
    Radu M. Secareanu
    Scott Warner
    Scott Seabridge
    Cathie Burke
    Thomas E. Watrobski
    Christopher Morton
    William Staub
    Thomas Tellier
    Eby G. Friedman
    Analog Integrated Circuits and Signal Processing, 2001, 28 : 253 - 264