Placement of substrate contacts to minimize substrate noise in mixed-signal integrated circuits

被引:9
|
作者
Secareanu, RM
Warner, S
Seabridge, S
Burke, C
Watrobski, TE
Morton, C
Staub, W
Tellier, T
Friedman, EG
机构
[1] Univ Rochester, Dept Elect & Comp Engn, Rochester, NY 14627 USA
[2] Xerox Corp, Ink Jet Supplies Business Unit, Webster, NY 14580 USA
关键词
substrate contacts; subtrate noise; mixed-signal; epitaxial and non-epitaxial technologies;
D O I
10.1023/A:1011204026940
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The placement of substrate contacts in epi and non-epi technologies is analyzed in order to control and reduce the substrate noise amplitude and spreading. The choice of small or large substrate contacts or rings for each of the two major technologies is highlighted. Design guidelines for placing substrate contacts so as to improve the noise immunity of digital circuits in mixed-signal smart-power systems are also presented.
引用
收藏
页码:253 / 264
页数:12
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