Development of Ultra-precision Grinder for 300mm Wafers

被引：1

作者：

Zhu, X. L. ^{[1
]}

Dong, Z. G. ^{[1
]}

Kang, R. K. ^{[1
]}

Guo, D. M. ^{[1
]}

机构：

[1] Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China

来源：

ADVANCES IN ABRASIVE TECHNOLOGY XV | 2012年 / 565卷

关键词：

Wafer grinder; Precision grinding; Silicon wafer; Design; On-line monitoring;

D O I：

10.4028/www.scientific.net/AMR.565.609

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder that is capable of grinding silicon wafers with surface roughness Ra<3 nm and total thickness variation<2 mu m/300mm.

引用

页码：609 / 614

页数：6

共 50 条

[41] A non-contact compensation method of an alignment and a radius of a grinding wheel in ultra-precision grinder
Fukuta, M
Yamane, Y
Sekiya, K
Sugino, T
[J]. PROGRESS OF MACHINING TECHNOLOGY, 2004, : 561 - 566
[42] Ultra-precision nanotechnology
Kurfess, TR
[J]. CONTROL ENGINEERING, 2005, 52 (03) : 8 - 8
[43] Effects of Etch Rate on Scallop of Through-Silicon Vias (TSVs) in 200mm and 300mm Wafers
Hsin, Yu-Chen
Chen, Chien-Chou
Lau, John H.
Tzeng, Pei-Jer
Shen, Shang-Hung
Hsu, Yi-Feng
Chen, Shang-Chun
Wn, Chien-Ying
Chen, Jui-Chin
Ku, Tzu-Kun
Kao, Ming-Jer
[J]. 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 1130 - 1135
[44] New high repeatability wafer geometry measurement technique for full 200mm and 300mm blank wafers
Trujillo-Sevilla, Juan M.
Perez-Garcia, Alvaro
Casanova-Gonzalez, Oscar
Velasco-Ocana, Miriam
Ceruso, Sabato
Oliva-Garcia, Ricardo
Gomez-Cardenes, Oscar
Martin-Hernandez, Javier
Roque-Velasco, Alex
Manuel Rodriguez-Ramos, Jose
Gaudestad, Jan O.
[J]. PHOTONIC INSTRUMENTATION ENGINEERING IX, 2022, 12008
[45] Ultra-precision medicine
不详
[J]. NATURE BIOTECHNOLOGY, 2021, 39 (06) : 645 - 645
[46] Ultra-precision grinding
Brinksmeier, E.
Mutluguenes, Y.
Klocke, F.
Aurich, J. C.
Shore, P.
Ohmori, H.
[J]. CIRP ANNALS-MANUFACTURING TECHNOLOGY, 2010, 59 (02) : 652 - 671
[47] Ultra-precision medicine
[J]. Nature Biotechnology, 2021, 39 : 645 - 645
[48] IMEC gains 300MM support
不详
[J]. IEE REVIEW, 2003, 49 (10): : 16 - 16
[49] Contamination control in 300mm foundry
Hsu, HJ
Chen, IC
Jann, L
[J]. 2002 SEMICONDUCTOR MANUFACTURING TECHNOLOGY WORKSHOP, 2002, : 212 - 214
[50] Evaluation techniques for 300mm equipment
Mautz, K
Morgenstern, T
Schuster, R
[J]. PROCESS CONTROL AND DIAGNOSTICS, 2000, 4182 : 316 - 326

← 1 2 3 4 5 →