Ultra-precision grinding

被引：440

作者：

Brinksmeier, E. ^{[1
]}

Mutluguenes, Y. ^{[1
]}

Klocke, F. ^{[2
]}

Aurich, J. C. ^{[3
]}

Shore, P. ^{[4
]}

Ohmori, H. ^{[5
]}

机构：

[1] Univ Bremen, Lab Precis Machining LFM, D-2800 Bremen 33, Germany

[2] Rhein Westfal TH Aachen, Lab Machine Tools & Prod Engn WZL, Aachen, Germany

[3] Tech Univ Kaiserslautern, Inst Mfg Engn & Prod Management FBK, Kaiserslautern, Germany

[4] Cranfield Univ, Sch Appl Sci, Cranfield MK43 0AL, Beds, England

[5] RIKEN, Inst Phys & Chem Res, Wako, Saitama, Japan

来源：

CIRP ANNALS-MANUFACTURING TECHNOLOGY | 2010年 / 59卷 / 02期

基金：

英国工程与自然科学研究理事会;

关键词：

Ultra-precision; Grinding; Finishing; FINITE-ELEMENT ANALYSIS; SILICON-WAFERS; OPTICAL-GLASSES; MANUFACTURING METHOD; TRUING METHOD; DICING BLADE; REGIME; WHEEL; GENERATION; MECHANISM;

D O I：

10.1016/j.cirp.2010.05.001

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Ultra-precision grinding is primarily used to generate high quality and functional parts usually made from hard and difficult to machine materials. The objective of ultra-precision grinding is to generate parts with high surface finish, high form accuracy and surface integrity for the electronic and optical industries as well as for astronomical applications. This keynote paper introduces general aspects of ultra-precision grinding techniques and point out the essential features of ultra-precision grinding. In particular, the keynote paper reviews the state-of-the-art regarding applied grinding tools, ultra-precision machine tools and grinding processes. Finally, selected examples of advanced ultra-precision grinding processes are presented. (C) 2010 CIRP.

引用

页码：652 / 671

页数：20

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