Development of Ultra-precision Grinder for 300mm Wafers

被引：1

作者：

Zhu, X. L. ^{[1
]}

Dong, Z. G. ^{[1
]}

Kang, R. K. ^{[1
]}

Guo, D. M. ^{[1
]}

机构：

[1] Dalian Univ Technol, Minist Educ, Key Lab Precis & Nontradit Machining Technol, Dalian 116024, Peoples R China

来源：

ADVANCES IN ABRASIVE TECHNOLOGY XV | 2012年 / 565卷

关键词：

Wafer grinder; Precision grinding; Silicon wafer; Design; On-line monitoring;

D O I：

10.4028/www.scientific.net/AMR.565.609

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

This study presents design of an ultra-precision wafer grinder which incorporates state-of-the-art automatic supervision and control system. The wafer grinder is characterized by wafer surface shape control, grinding forces and wafer thickness monitoring systems. The design provides a totally integrated solution to the ultra-precision grinder that is capable of grinding silicon wafers with surface roughness Ra<3 nm and total thickness variation<2 mu m/300mm.

引用

页码：609 / 614

页数：6

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