Flip-chip for millimeter-wave and broadband packaging

被引：0
|
作者：
Heinrich, Wolfgang [1 ]
机构：
[1] Ferdinand Braun Inst Hochstfrequenztechn, D-12489 Berlin, Germany
来源：
2005 IEEE INTERNATIONAL WORKSHOP ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY, PROCEEDINGS: INTEGRATED CIRCUITS FOR WIDEBAND COMMUNICATION AND WIRELESS SENSOR NETWORKS | 2005年
关键词：
flip-chip; mm-waves; packaging; multi-chip modules;
D O I：
10.1109/RFIT.2005.1598871
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Emerging markets for mm-wave wireless and sensor systems as well as high bit-rate components demand for cost-effective packaging solutions. Flip-chip is one of the most promising approaches in this regard combining high-volume potential with excellent high-frequency performance. The talk presents the different flip-chip concepts in use, focusing on the microwave characteristics and approaching the subject from the designer's point of view. Basic electromagnetic properties of the interconnects as well as consequences for chip and package design are discussed. As carrier substrates, conventional ceramics, thin-film, and LTCC-multilayer approaches are covered. Experimental results for various applications document feasibility and capabilities in the frequency range up to 100 GHz.
引用
收藏
页码：50 / 52
页数：3
相关论文
共 50 条
  • [1] The flip-chip approach for millimeter-wave packaging
    Heinrich, W
    [J]. IEEE MICROWAVE MAGAZINE, 2005, 6 (03) : 36 - 45
  • [2] Optimization of flip-chip interconnects for millimeter-wave frequencies
    Jentzsch, A
    Heinrich, W
    [J]. 1999 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-4, 1999, : 637 - 640
  • [3] Advantages of flip chip technology in millimeter-wave packaging
    Krems, T
    Haydl, WH
    Massler, H
    Rudiger, J
    [J]. 1997 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS I-III: HIGH FREQUENCIES IN HIGH PLACES, 1997, : 987 - 990
  • [4] Broadband planar millimeter wave dipole with flip-chip interconnect
    Zwick, Thomas
    Pfeiffer, Ullrich
    Liu, Duixian
    Gaucher, Brian
    [J]. 2007 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM, VOLS 1-12, 2007, : 4586 - 4589
  • [5] Effects of underfill on wideband flip-chip packaging for 5G millimeter-wave applications
    Xia, Haiyang
    Zhang, Tao
    Liu, Zhiqiang
    Liu, Huan
    Wu, Xu
    Li, Lianming
    Wang, Zhigong
    [J]. IEICE ELECTRONICS EXPRESS, 2023,
  • [6] Broadband flip-chip interconnects for millimeter-wave Si-carrier System-on-Package
    Li, Chun-Hsing
    Fu, Chang Tsung
    Chao, Tzu-Yuan
    Kuo, Chien-Nan
    Cheng, Y. T.
    Chang, D. -C.
    [J]. 2007 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-6, 2007, : 1640 - +
  • [7] Millimeter-wave characteristics of flip-chip interconnects for multichip modules
    Heinrich, W
    Jentzsch, A
    Baumann, G
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1998, 46 (12) : 2264 - 2268
  • [8] The flip-chip bump interconnection for millimeter-wave GaAs MMIC
    Kusamitsu, H
    Morishita, Y
    Maruhashi, K
    Ito, M
    Ohata, K
    [J]. 1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 47 - 52
  • [9] Millimeter-wave characteristics of flip-chip interconnects for multichip modules
    Heinrich, Wolfgang
    Jentzsch, Andrea
    Baumann, Guido
    [J]. IEEE Transactions on Microwave Theory and Techniques, 1998, 46 (12 pt 2): : 2264 - 2268
  • [10] Suppression of the CPW leakage in common millimeter-wave flip-chip structures
    Lee, GA
    Lee, HY
    [J]. IEEE MICROWAVE AND GUIDED WAVE LETTERS, 1998, 8 (11): : 366 - 368
12345