The flip-chip approach for millimeter-wave packaging

The issues related to application of the flip-chips for millimeter wave packaging are discussed. It is understood that in multichip packaging techniques, the flip-chip approach meets the challenges of cost requirements in fabrication and functioning of interconnects in providing good millimeter wave performance. The flip-chip technique is well proven for lower frequencies and soldering and thermocompression are the two techniques used in RF flip-chip integration. The issues related to interconnects modeling and optimization, and the role of flip-chips in offering excellent potential in realizing high-frequency interconnects at moderate processing efforts, are also discussed.