Flip-chip for millimeter-wave and broadband packaging

被引：0
|
作者：
Heinrich, Wolfgang [1 ]
机构：
[1] Ferdinand Braun Inst Hochstfrequenztechn, D-12489 Berlin, Germany
来源：
2005 IEEE INTERNATIONAL WORKSHOP ON RADIO-FREQUENCY INTEGRATION TECHNOLOGY, PROCEEDINGS: INTEGRATED CIRCUITS FOR WIDEBAND COMMUNICATION AND WIRELESS SENSOR NETWORKS | 2005年
关键词：
flip-chip; mm-waves; packaging; multi-chip modules;
D O I：
10.1109/RFIT.2005.1598871
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Emerging markets for mm-wave wireless and sensor systems as well as high bit-rate components demand for cost-effective packaging solutions. Flip-chip is one of the most promising approaches in this regard combining high-volume potential with excellent high-frequency performance. The talk presents the different flip-chip concepts in use, focusing on the microwave characteristics and approaching the subject from the designer's point of view. Basic electromagnetic properties of the interconnects as well as consequences for chip and package design are discussed. As carrier substrates, conventional ceramics, thin-film, and LTCC-multilayer approaches are covered. Experimental results for various applications document feasibility and capabilities in the frequency range up to 100 GHz.
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页码：50 / 52
页数：3
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