Minimizationof Wirelength in 3d IC Routing By Using Differential Evolution Algorithm

被引:0
|
作者
Pandiaraj, K. [1 ]
Sivakumar, P. [1 ]
Sridevi, R. [1 ]
机构
[1] Kalasalingam Univ, Elect & Commun Engn Dept, Virudunagar 626126, Tamil Nadu, India
关键词
Global Routing; 3D IC; Wire length;
D O I
暂无
中图分类号
TP39 [计算机的应用];
学科分类号
081203 ; 0835 ;
摘要
The wire-length of vertically stacked ICs plays a vital role. The wire-length is minimized by using differential evolutionary algorithms withIBM Benchmark inputs. Moreover this wire length is minimized with the respect to the length of the Through Silicon via (TSVs). As a result, the wire-length has been minimized using this algorithm with various parameters. Experimental result shows that the total wirelength can be reduced.
引用
收藏
页数:5
相关论文
共 50 条
  • [1] TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing
    Zhao, Yi
    Hao, Cong
    Yoshimura, Takeshi
    [J]. 2018 28TH INTERNATIONAL SYMPOSIUM ON POWER AND TIMING MODELING, OPTIMIZATION AND SIMULATION (PATMOS), 2018, : 155 - 162
  • [2] Simultaneous optimization of the area, wirelength and TSVs in a 3D IC design
    Atul Prakash
    Rajesh Kumar Lal
    [J]. Sādhanā, 47
  • [3] Simultaneous optimization of the area, wirelength and TSVs in a 3D IC design
    Prakash, Atul
    Lal, Rajesh Kumar
    [J]. SADHANA-ACADEMY PROCEEDINGS IN ENGINEERING SCIENCES, 2022, 47 (04):
  • [4] Rectilinear routing algorithm for crosstalk minimisation in 2D and 3D IC
    Mondal, Khokan
    Das, Subhajit
    Samanta, Tuhina
    [J]. IET COMPUTERS AND DIGITAL TECHNIQUES, 2020, 14 (06): : 263 - 271
  • [5] Reduction of Temperature Rise in 3D IC Routing
    Pandiaraj, K.
    Sivakumar, P.
    Geetharamani, N.
    [J]. 2017 IEEE INTERNATIONAL CONFERENCE ON ELECTRICAL, INSTRUMENTATION AND COMMUNICATION ENGINEERING (ICEICE), 2017,
  • [6] Localization in 3D Environments Using Differential Evolution
    Martin, Fernando
    Moreno, Luis
    Garrido, Santiago
    Blanco, Dolores
    [J]. WISP 2009: 6TH IEEE INTERNATIONAL SYMPOSIUM ON INTELLIGENT SIGNAL PROCESSING, PROCEEDINGS, 2009, : 15 - 20
  • [7] Testing of 3D IC with minimum power using Genetic Algorithm
    Kaibartta, Tanusree
    Das, Debesh K.
    [J]. 2015 10TH INTERNATIONAL DESIGN & TEST SYMPOSIUM (IDT), 2015, : 112 - 117
  • [8] Optimization of thermal aware multilevel routing for 3D IC
    Sivakumar, P.
    Pandiaraj, K.
    JeyaPrakash, K.
    [J]. ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING, 2020, 103 (01) : 131 - 142
  • [9] Optimization of thermal aware multilevel routing for 3D IC
    P. Sivakumar
    K. Pandiaraj
    K. JeyaPrakash
    [J]. Analog Integrated Circuits and Signal Processing, 2020, 103 : 131 - 142
  • [10] 3D Avatar Animation Optimization in Metaverse by Differential Evolution Algorithm
    Paweroi, Rio Mukhtarom
    Koppen, Mario
    [J]. 2023 INTERNATIONAL CONFERENCE ON INTELLIGENT METAVERSE TECHNOLOGIES & APPLICATIONS, IMETA, 2023, : 143 - 149