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- [1] TSV Assignment of Thermal and Wirelength Optimization for 3D-IC Routing 2018 28TH INTERNATIONAL SYMPOSIUM ON POWER AND TIMING MODELING, OPTIMIZATION AND SIMULATION (PATMOS), 2018, : 155 - 162
- [3] Simultaneous optimization of the area, wirelength and TSVs in a 3D IC design SADHANA-ACADEMY PROCEEDINGS IN ENGINEERING SCIENCES, 2022, 47 (04):
- [4] Rectilinear routing algorithm for crosstalk minimisation in 2D and 3D IC IET COMPUTERS AND DIGITAL TECHNIQUES, 2020, 14 (06): : 263 - 271
- [5] Reduction of Temperature Rise in 3D IC Routing 2017 IEEE INTERNATIONAL CONFERENCE ON ELECTRICAL, INSTRUMENTATION AND COMMUNICATION ENGINEERING (ICEICE), 2017,
- [6] Localization in 3D Environments Using Differential Evolution WISP 2009: 6TH IEEE INTERNATIONAL SYMPOSIUM ON INTELLIGENT SIGNAL PROCESSING, PROCEEDINGS, 2009, : 15 - 20
- [7] Testing of 3D IC with minimum power using Genetic Algorithm 2015 10TH INTERNATIONAL DESIGN & TEST SYMPOSIUM (IDT), 2015, : 112 - 117
- [8] 3D Avatar Animation Optimization in Metaverse by Differential Evolution Algorithm 2023 INTERNATIONAL CONFERENCE ON INTELLIGENT METAVERSE TECHNOLOGIES & APPLICATIONS, IMETA, 2023, : 143 - 149
- [9] Optimization of thermal aware multilevel routing for 3D IC Analog Integrated Circuits and Signal Processing, 2020, 103 : 131 - 142