Submicron holes in copper thin film directly ablated using femtosecond pulsed laser

被引:9
|
作者
Venkatakrishnan, K [1 ]
Tan, B [1 ]
Ngoi, BKA [1 ]
机构
[1] Nanyang Technol Univ, Sch Mech & Prod Engn, Precis Engn & Nanotechnol Ctr, Singapore 639798, Singapore
关键词
laser ablation; femtosecond-pulsed laser;
D O I
10.1117/1.1419024
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Submicron holes in copper thin film were ablated using femtosecond pulsed laser. The analysis was carried out using a chirped-pulse-amplification-based Ti:sapphire systems. The system produced pulses of 800 nm wavelength and minimum pulse width of 150 fs at a repetition rate of 1 kHz. The original pulse from the laser system was made to pass through a second harmonic generator resulting in frequency doubling, to achieve ultraviolet radiation range wavelength.
引用
收藏
页码:2892 / 2893
页数:2
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