Hermetic thick film multichip modules

被引：0

作者：

Keusseyan, R ^{[1
]}

Sawhill, H ^{[1
]}

Horowitz, S ^{[1
]}

Horne, G ^{[1
]}

机构：

[1] DUPONT CO INC,ELECTR,RES TRIANGLE PK,NC 27709

来源：

1966 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES, PROCEEDINGS | 1996年 / 2794卷

关键词：

integrated; hermetic; thick film; MCM; brazing; high performance; high reliability;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：52 / 57

页数：6

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