PROGRAMMABLE MULTICHIP MODULES

被引：2
|
作者：
BURMAN, S [1 ]
SHERWANI, NA [1 ]
机构：
[1] WESTERN MICHIGAN UNIV, DEPT COMP SCI, KALAMAZOO, MI 49008 USA
来源：
IEEE MICRO | 1993年 / 13卷 / 02期
基金：
美国国家科学基金会;
关键词：
D O I：
10.1109/40.207086
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
The MCM approach to electronic packaging improves system performance by bridging the gap between the current packaging technology and advancing IC technology. However, with out a mature infrastructure, a fully customized MCM design takes significant engineering effort and incurs costly fabrication fees and cost increases for each mask layer. Programmable MCMs - wafers with sites for chips and several layers of programmable interconnections -minimize the engineering delays and the cost.
引用
收藏
页码：28 / 35
页数：8
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