PROGRAMMABLE MULTICHIP MODULES

The MCM approach to electronic packaging improves system performance by bridging the gap between the current packaging technology and advancing IC technology. However, with out a mature infrastructure, a fully customized MCM design takes significant engineering effort and incurs costly fabrication fees and cost increases for each mask layer. Programmable MCMs - wafers with sites for chips and several layers of programmable interconnections -minimize the engineering delays and the cost.