Hermetic thick film multichip modules

被引：0
|
作者：
Keusseyan, R [1 ]
Sawhill, H [1 ]
Horowitz, S [1 ]
Horne, G [1 ]
机构：
[1] DUPONT CO INC,ELECTR,RES TRIANGLE PK,NC 27709
来源：
1966 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES, PROCEEDINGS | 1996年 / 2794卷
关键词：
integrated; hermetic; thick film; MCM; brazing; high performance; high reliability;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：52 / 57
页数：6
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