Design and Architectural Assessment of 3-D Resistive Memory Technologies in FPGAs

被引:35
|
作者
Gaillardon, Pierre-Emmanuel [1 ]
Sacchetto, Davide [2 ]
Beneventi, Giovanni Betti [3 ]
Ben Jamaa, M. Haykel [3 ]
Perniola, Luca [3 ]
Clermidy, Fabien [3 ]
O'Connor, Ian [4 ,5 ]
De Micheli, Giovanni [1 ]
机构
[1] Ecole Polytech Fed Lausanne, Lab Syst Integrat, CH-1015 Lausanne, Switzerland
[2] Ecole Polytech Fed Lausanne, Lab MicroElect Syst, CH-1015 Lausanne, Switzerland
[3] Commissariat Energie Atom & Energies Alternat, F-38054 Grenoble, France
[4] Ecole Cent Lyon, F-69134 Ecully, France
[5] Ecole Polytech, Montreal, PQ H3T 1J4, Canada
基金
欧洲研究理事会;
关键词
3-D integration; nonvolatile memory; oxide memory; phase-change memory; programmable logic arrays; RRAM;
D O I
10.1109/TNANO.2012.2226747
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Emerging nonvolatile memories (ENVMs) such as phase-change random access memories (PCRAMs) or oxide-based resistive random access memories (OxRRAMs) are promising candidates to replace Flash and Static Random Access Memories in many applications. This paper introduces a novel set of building blocks for field-programmable gate arrays (FPGAs) using ENVMs. We propose an ENVM-based configuration point, a look-up table structure with reduced programming complexity and a high-performance switchbox arrangement. We show that these blocks yield an improvement in area and write time of up to 3x and 33x, respectively, versus a regular Flash implementation. By integrating the designed blocks in an FPGA, we demonstrate an area and delay reduction of up to 28% and 34%, respectively, on a set of benchmark circuits. These reductions are due to the ENVM 3-D integration and to their low on-resistance state value. Finally, we survey many flavors of the technologies and we show that the best results in terms of area and delay are obtained with Pt/TiO2/Pt stack, while the lowest leakage power is achieved by InGeTe stack.
引用
收藏
页码:40 / 50
页数:11
相关论文
共 50 条
  • [21] 3-D printed Smart Slab offers unique architectural design, lower carbon footprint
    不详
    AMERICAN CERAMIC SOCIETY BULLETIN, 2018, 97 (08): : 23 - 23
  • [22] A Novel Framework for Exploring 3-D FPGAs with Heterogeneous Interconnect Fabric
    Siozios, Kostas
    Pavlidis, Vasilis F.
    Soudris, Dimitrios
    ACM TRANSACTIONS ON RECONFIGURABLE TECHNOLOGY AND SYSTEMS, 2012, 5 (01) : 1 - 23
  • [23] 3-D displays - Technologies and testing methods
    Abileah, Adi
    JOURNAL OF THE SOCIETY FOR INFORMATION DISPLAY, 2011, 19 (11) : 749 - 763
  • [24] 3-D displays: A review of current technologies
    Pastoor, S
    Wopking, M
    DISPLAYS, 1997, 17 (02) : 100 - 110
  • [25] Recent Developments in 3-D Imaging Technologies
    Son, Jung-Young
    Javidi, Bahram
    Yano, Sumio
    Choi, Kyu-Hwan
    JOURNAL OF DISPLAY TECHNOLOGY, 2010, 6 (10): : 394 - 403
  • [26] Emerging 3-D Imaging and Display Technologies
    Javidi, Bahram
    Tekalp, A. Murat
    PROCEEDINGS OF THE IEEE, 2017, 105 (05) : 786 - 788
  • [27] HIGHWAY DESIGN IN 3-D
    SULLIVAN, RD
    CIVIL ENGINEERING, 1992, 62 (06): : 68 - 70
  • [28] Scanning the Issue: 3-D Integration Technologies
    Campardo, Giovanni
    Ripamonti, Giancarlo
    Micheloni, Rino
    PROCEEDINGS OF THE IEEE, 2009, 97 (01) : 5 - 8
  • [29] Fiber concrete for 3-D additive technologies
    Klyuev S.V.
    Klyuev A.V.
    Shorstova E.S.
    Materials Science Forum, 2019, 974 : 367 - 372
  • [30] Examining 3-D Technologies in Laptop Displays
    Burks, Rick
    Harper, Christy
    Bartha, Michael C.
    ERGONOMICS IN DESIGN, 2014, 22 (03) : 17 - 22