Design and Architectural Assessment of 3-D Resistive Memory Technologies in FPGAs

被引:35
|
作者
Gaillardon, Pierre-Emmanuel [1 ]
Sacchetto, Davide [2 ]
Beneventi, Giovanni Betti [3 ]
Ben Jamaa, M. Haykel [3 ]
Perniola, Luca [3 ]
Clermidy, Fabien [3 ]
O'Connor, Ian [4 ,5 ]
De Micheli, Giovanni [1 ]
机构
[1] Ecole Polytech Fed Lausanne, Lab Syst Integrat, CH-1015 Lausanne, Switzerland
[2] Ecole Polytech Fed Lausanne, Lab MicroElect Syst, CH-1015 Lausanne, Switzerland
[3] Commissariat Energie Atom & Energies Alternat, F-38054 Grenoble, France
[4] Ecole Cent Lyon, F-69134 Ecully, France
[5] Ecole Polytech, Montreal, PQ H3T 1J4, Canada
基金
欧洲研究理事会;
关键词
3-D integration; nonvolatile memory; oxide memory; phase-change memory; programmable logic arrays; RRAM;
D O I
10.1109/TNANO.2012.2226747
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Emerging nonvolatile memories (ENVMs) such as phase-change random access memories (PCRAMs) or oxide-based resistive random access memories (OxRRAMs) are promising candidates to replace Flash and Static Random Access Memories in many applications. This paper introduces a novel set of building blocks for field-programmable gate arrays (FPGAs) using ENVMs. We propose an ENVM-based configuration point, a look-up table structure with reduced programming complexity and a high-performance switchbox arrangement. We show that these blocks yield an improvement in area and write time of up to 3x and 33x, respectively, versus a regular Flash implementation. By integrating the designed blocks in an FPGA, we demonstrate an area and delay reduction of up to 28% and 34%, respectively, on a set of benchmark circuits. These reductions are due to the ENVM 3-D integration and to their low on-resistance state value. Finally, we survey many flavors of the technologies and we show that the best results in terms of area and delay are obtained with Pt/TiO2/Pt stack, while the lowest leakage power is achieved by InGeTe stack.
引用
收藏
页码:40 / 50
页数:11
相关论文
共 50 条
  • [41] 3-D Content Addressable Memory Architectures
    Hu, Yong-Jyun
    Li, Jin-Fu
    Huang, Yu-Jen
    2009 IEEE INTERNATIONAL WORKSHOP ON MEMORY TECHNOLOGY, DESIGN, AND TESTING, PROCEEDINGS, 2009, : 59 - 64
  • [42] Complex 3-D behaviors of composite cylinders with 3-D shape memory alloy actuators
    Kim, C
    Lee, SH
    INTERNATIONAL JOURNAL OF MODERN PHYSICS B, 2003, 17 (8-9): : 1851 - 1856
  • [43] RET for the wiring layer of a 3-D memory
    Chen, Yung-Tin
    Poon, Paul
    Petti, Chris
    Kamat, Vishnu
    Sezginer, Apo
    Huang, Hsu-Ting
    DESIGN AND PROCESS INTEGRATION FOR MICROELECTRONIC MANUFACTURING IV, 2006, 6156
  • [44] A distributed memory algorithm for 3-D FFTs
    Costian, CR
    Marinescu, DC
    JOURNAL OF COMPUTATIONAL AND APPLIED MATHEMATICS, 1996, 66 (1-2) : 139 - 151
  • [45] 3-D Renal Donor Assessment
    Gellada, Norman H.
    Noya, David
    RADIOLOGIC TECHNOLOGY, 2020, 92 (01) : 87 - 89
  • [46] 3-D fMRI of working memory in schizophrenia
    Callicott, JH
    Tallent, K
    Bertolino, A
    Ramsey, N
    Santha, A
    Knable, M
    Coppola, R
    Goldberg, T
    Mattay, V
    vanGelderen, P
    Frank, JA
    Moonen, CTW
    Weinberger, DR
    BIOLOGICAL PSYCHIATRY, 1996, 39 (07) : 466 - 466
  • [47] Space Program Scheme for 3-D NAND Flash Memory Specialized for the TLC Design
    Kang, Ho-Jung
    Choi, Nagyong
    Lee, Dong Hwan
    Lee, Tackhwi
    Chung, Sungyong
    Bae, Jong-Ho
    Park, Byung-Gook
    Lee, Jong-Ho
    2018 IEEE SYMPOSIUM ON VLSI TECHNOLOGY, 2018, : 201 - 202
  • [48] Interactive 3-D video representation and coding technologies
    Smolic, A
    Kauff, P
    PROCEEDINGS OF THE IEEE, 2005, 93 (01) : 98 - 110
  • [49] A Logic-on-Memory Processor-System Design With Monolithic 3-D Technology
    Pentapati, Sai
    Zhu, Lingjun
    Bamberg, Lennart
    Shim, Da Eun
    Garcia-Ortiz, Alberto
    Lim, Sung Kyu
    IEEE MICRO, 2019, 39 (06) : 38 - 45
  • [50] Connectivity and 3-D Technologies for the Future Digital Enterprise
    Andreas Rüdenauer
    Julien Kipp
    Martin Scherer
    Bernhard Jahnke
    ATZoffhighway worldwide, 2016, 9 (1): : 54 - 57