Low-cost diagnosis of defects in MCM substrate interconnections

被引：0
|
作者：
Kim, BC [1 ]
Chatterjee, A [1 ]
Swaminathan, M [1 ]
机构：
[1] GEORGIA INST TECHNOL,SCH ELECT & COMP ENGN,ATLANTA,GA 30332
来源：
14TH IEEE VLSI TEST SYMPOSIUM, PROCEEDINGS | 1996年
关键词：
D O I：
10.1109/VTEST.1996.510866
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：260 / 265
页数：6
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