Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

被引：0
|
作者：
Costello, S. [1 ]
Strusevich, N. [2 ]
Flynn, D. [1 ]
Kay, R. W. [1 ]
Patel, M. K. [2 ]
Bailey, C. [2 ]
Price, D. [3 ]
Bennet, M. [4 ]
Jones, A. C. [4 ]
Desmulliez, M. P. Y. [1 ]
机构：
[1] Heriot Watt Univ, MIcroSyst Engn Ctr MISEC, Sch Engn & Phys Sci, Edinburgh EH14 4AS, Midlothian, Scotland
[2] Univ Greenwich, Sch Comp & Math Sci, Old Royal Naval Coll, London SE109LS, England
[3] Merlin Circuit Technol Ltd, Deeside CH53QZ, Clwyd, Wales
[4] Univ Edinburgh, Sch Chem, Edinburgh EH93JF, Midlothian, Scotland
来源：
2012 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP) | 2012年
基金：
英国工程与自然科学研究理事会;
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.
引用
收藏
页码：98 / 102
页数：5
相关论文
共 50 条
  • [1] Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
    S. Costello
    N. Strusevich
    D. Flynn
    R. W. Kay
    M. K. Patel
    C. Bailey
    D. Price
    M. Bennet
    A. C. Jones
    M. P. Y. Desmulliez
    [J]. Microsystem Technologies, 2013, 19 : 783 - 790
  • [2] Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
    Costello, S.
    Strusevich, N.
    Flynn, D.
    Kay, R. W.
    Patel, M. K.
    Bailey, C.
    Price, D.
    Bennet, M.
    Jones, A. C.
    Desmulliez, M. P. Y.
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2013, 19 (06): : 783 - 790
  • [3] Effect of Ultrasound Agitation on the Properties of Copper Electrodeposition in Micro-Via
    Wu, Houya
    Wang, Yan
    Wang, Fuliang
    Zhu, Wenhui
    [J]. 2018 19TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2018,
  • [4] Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias
    Kaufmann, Jens
    Desmulliez, Marc P. Y.
    Price, Dennis
    Hughes, Mike
    Strussevich, Nadia
    Bailey, Chris
    [J]. ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 1235 - +
  • [5] Megasonic agitation for enhanced electrodeposition of copper
    Kaufmann, Jens Georg
    Desmulliez, Marc P. Y.
    Tian, Yingtao
    Price, Dennis
    Hughes, Mike
    Strusevich, Nadia
    Bailey, Chris
    Liu, Changqing
    Hutt, David
    [J]. MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2009, 15 (08): : 1245 - 1254
  • [6] Megasonic agitation for enhanced electrodeposition of copper
    Jens Georg Kaufmann
    Marc P. Y. Desmulliez
    Yingtao Tian
    Dennis Price
    Mike Hughes
    Nadia Strusevich
    Chris Bailey
    Changqing Liu
    David Hutt
    [J]. Microsystem Technologies, 2009, 15 : 1245 - 1254
  • [7] Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation
    Costello, S.
    Strusevich, N.
    Patel, M. K.
    Bailey, C.
    Flynn, D.
    Kay, R. W.
    Price, D.
    Bennet, M.
    Jones, A. C.
    Habeshaw, R.
    Demore, C.
    Cochran, S.
    Desmulliez, M. P. Y.
    [J]. EMPC-2011: 18TH EUROPEAN MICROELECTRONICS & PACKAGING CONFERENCE, 2011,
  • [8] High Density Indium Bumping Using Electrodeposition Enhanced by Megasonic Agitation
    Tian, Yingtao
    Liu, Changqing
    Hutt, David
    Stevens, Bob
    Flynn, David
    Desmulliez, Marc P. Y.
    [J]. 2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 31 - +
  • [9] Investigation of High Speed Micro-bump Formation through Electrodeposition Enhanced by Megasonic Agitation
    Tian, Yingtao
    Liu, Changqing
    Hutt, David
    Stevens, Bob
    Flynn, David
    Desmulliez, Marc P. Y.
    [J]. 2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP), 2011, : 739 - 744
  • [10] Electrodeposition and Growth Mechanism of Nanotwinned Copper in High Aspect-Ratio via Structures
    Chen, Hsin-Yu
    Huang, Yan-Syun
    Liao, Chien-Neng
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2021, 168 (10)
12345