Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

被引:19
|
作者
Costello, S. [1 ]
Strusevich, N. [2 ]
Flynn, D. [1 ]
Kay, R. W. [1 ]
Patel, M. K. [2 ]
Bailey, C. [2 ]
Price, D. [3 ]
Bennet, M. [4 ]
Jones, A. C. [4 ]
Desmulliez, M. P. Y. [1 ]
机构
[1] Heriot Watt Univ, Sch Engn & Phys Sci, MicroSyst Engn Ctr MISEC, Edinburgh EH14 4AS, Midlothian, Scotland
[2] Univ Greenwich, Sch Comp & Math Sci, Old Royal Naval Coll, London SE10 9LS, England
[3] Merlin Circuit Technol Ltd, Deeside CH5 3QZ, Clwyd, Wales
[4] Univ Edinburgh, Sch Chem, Edinburgh EH9 3JF, Midlothian, Scotland
基金
英国工程与自然科学研究理事会;
关键词
PMMA; High Aspect Ratio; Seed Layer; Large Channel; Acoustic Streaming;
D O I
10.1007/s00542-013-1746-7
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. The cross section of a PCB via is fabricated in PMMA to allow optical access to the sample. Fluid flow within two 1:1 aspect ratio blind micro-vias, one with straight side walls and the other with tapered side walls were compared. Flow is also analysed in a 1:1 aspect ratio through via. Flow rates measured using micro-PIV are used to validate simulated flow models. The results show that there are increased flow rates within the blind via with tapered side walls. This goes some way to explaining the improved electroplating results obtained in industry when tapered vias are used. Initial experimental results using megasonic streaming to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition are also reported.
引用
收藏
页码:783 / 790
页数:8
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