Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

被引：0

作者：

Costello, S. ^{[1
]}

Strusevich, N. ^{[2
]}

Flynn, D. ^{[1
]}

Kay, R. W. ^{[1
]}

Patel, M. K. ^{[2
]}

Bailey, C. ^{[2
]}

Price, D. ^{[3
]}

Bennet, M. ^{[4
]}

Jones, A. C. ^{[4
]}

Desmulliez, M. P. Y. ^{[1
]}

机构：

[1] Heriot Watt Univ, MIcroSyst Engn Ctr MISEC, Sch Engn & Phys Sci, Edinburgh EH14 4AS, Midlothian, Scotland

[2] Univ Greenwich, Sch Comp & Math Sci, Old Royal Naval Coll, London SE109LS, England

[3] Merlin Circuit Technol Ltd, Deeside CH53QZ, Clwyd, Wales

[4] Univ Edinburgh, Sch Chem, Edinburgh EH93JF, Midlothian, Scotland

来源：

2012 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP) | 2012年

基金：

英国工程与自然科学研究理事会;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.

引用

页码：98 / 102

页数：5

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