On the Design of energy-Efficient I/O Circuits for Interposer-based 2.5D System-in-Package

被引：0
|
作者：
Lee, M. [1 ]
Kim, J. [1 ]
Singh, A. [1 ]
Torun, H. M. [1 ]
Swaminathan, M. [1 ]
Lim, S. [1 ]
Mukhopadhyay, S. [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
2018 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S) | 2018年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页数：3
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