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- [41] Ionic species in 13.56 MHz discharges in CF4 gas and mixtures of it with Ar and O2 Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1997, 36 (7 B): : 4648 - 4650
- [42] Novel technique to pattern silver using CF4 and CF4/O2 glow discharges JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2001, 19 (01): : 158 - 165
- [45] Impact of plasma operating conditions on the ion energy and angular distributions in dual-frequency capacitively coupled plasma reactors using CF4 chemistry JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2024, 42 (01):
- [46] Electron heating and the electrical asymmetry effect in dual-frequency capacitive CF4 discharges PLASMA SOURCES SCIENCE & TECHNOLOGY, 2011, 20 (04):
- [47] Probe measurements and global model of inductively coupled Ar/CF4 discharges Plasma Sources Science and Technology, 1999, 8 (04): : 553 - 560
- [48] Probe measurements and global model of inductively coupled Ar/CF4 discharges PLASMA SOURCES SCIENCE & TECHNOLOGY, 1999, 8 (04): : 553 - 560
- [49] Enhancement of etch rate by the addition of O2 and Ar in chemical dry etching of Si using a discharge flow of Ar/CF4 and CF4/O2 gas mixtures JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2001, 40 (4A): : 2440 - 2446
- [50] Optimization of silicon etch rate in a CF4/Ar/O2 inductively coupled plasma JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2022, 40 (03):