Antenna-in-Package in HDI technology for 5G Millimeter-Wave Communications

In this paper, a novel phased-array antenna-in-package in high density interconnect technology (HDI) is proposed to achieve low profile, low cost, wide band and wide angle scanning property for 5G millimeter-wave communication. The thickness of the antenna layer for the proposed antenna-in-package is 0.75mm, which is only 0.065 lambda(0) at the center frequency of 5G operating band starts from 24.25 GHz to 27.5 GHz. Simulation results shows that the proposed antenna-in-package is well matched with a VSWR lower than 2.2 for all beam scanning states over the 5G operating band. A 4x4 subarray module based on four SiGe ICs is presented, and a 16x16 phased-array antenna-in-package is then designed to realize wide angle beam scanning property, namely, 59.5 degrees in H-plane and 30 degrees in E-plane without grating lobe, by splicing the subarray modules.