Antenna-in-Package in HDI technology for 5G Millimeter-Wave Communications

被引：0

作者：

Che, Bang-Jun ^{[1
]}

Wang, Quan ^{[1
]}

Zhang, Li-Wei ^{[1
]}

Zhang, Xiao-Lin ^{[1
]}

Jin, Mou-Ping ^{[1
]}

机构：

[1] CETC 38 China Elect Technol Grp Corp, Res Inst 38, Anhui Prov Engn Lab Antennas & Microwave, 199th Xiangzhang Ave, Hefei, Peoples R China

来源：

2022 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT) | 2022年

关键词：

antenna-in-package (AiP); phased-array; high density interconnect technology (HDI); 5G communication;

D O I：

10.1109/ICMMT55580.2022.10022359

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, a novel phased-array antenna-in-package in high density interconnect technology (HDI) is proposed to achieve low profile, low cost, wide band and wide angle scanning property for 5G millimeter-wave communication. The thickness of the antenna layer for the proposed antenna-in-package is 0.75mm, which is only 0.065 lambda(0) at the center frequency of 5G operating band starts from 24.25 GHz to 27.5 GHz. Simulation results shows that the proposed antenna-in-package is well matched with a VSWR lower than 2.2 for all beam scanning states over the 5G operating band. A 4x4 subarray module based on four SiGe ICs is presented, and a 16x16 phased-array antenna-in-package is then designed to realize wide angle beam scanning property, namely, 59.5 degrees in H-plane and 30 degrees in E-plane without grating lobe, by splicing the subarray modules.

引用

页数：3

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