Antenna-in-Package Design and Module Integration for Millimeter-Wave Communication and 5G

被引：0

作者：

Gu, Xiaoxiong ^{[1
]}

Sadhu, Bodhisatwa ^{[1
]}

Liu, Duixian ^{[1
]}

Baks, Christian ^{[1
]}

Valdes-Garcia, Alberto ^{[1
]}

机构：

[1] IBM TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA

来源：

2018 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT) | 2018年

关键词：

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Co-design and integration of RFIC, package, and antennas are critical to enable 5G wireless communications and is particularly challenging at mmWave frequencies. This paper reviews two different aspects of mmWave antenna module packaging and integration for base station and user equipment applications, respectively. We first present the challenges, implementation, and characterization of a 28-GHz phased-array module with 64 dual polarized antennas for 5G base station applications. Next, we describe a compact, low-power, 60-GHz switched-beam transceiver module suitable for handset integration incorporating 4 antennas that supports both normal and end-fire directions for a wide link spatial coverage.

引用

页数：2

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