Bonded strength and reliability under high temperature and humid environment for silver alloy bonding wire

被引：0
|
作者：
Cao, Jun [1 ,2 ]
Hua, Han [1 ]
机构：
[1] HeNan Polytech Univ, Sch Mech & Power Engn, 2001 ShiJi Rd, Jiaozuo, Henan, Peoples R China
[2] HeNan YOUK Elect Mat Co LTD, High Tech Pk, Jiyuan, Peoples R China
来源：
2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC) | 2018年
关键词：
Silver alloy bonding wire; Ti; Y; Free air ball; Reliability; PCT; COPPER WIRE; AIR;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the study, bonded strength and reliability under high temperature and humid environment for silver alloy bonding wire were investigated. It was found that Ti (0.05%wt) and Y (0.05%wt) doped in the Ag-4.5%Pd alloy bonding wire could form substitutional solid solution with Ag, those did not cause golf ball defects. Minute quantities Ti and Y can refine the grain size, form uniform structure, improve the mechanical properties and bonded strength, and the reliability was improved. After PCT test, cracks were not found in the bonding interface, the ball shear strength and ball pull force of silver alloy wire decreased, and the reliability is better after doping some Ti and Y.
引用
收藏
页码：341 / 345
页数：5
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