Bonded strength and reliability under high temperature and humid environment for silver alloy bonding wire

被引：0
|
作者：
Cao, Jun [1 ,2 ]
Hua, Han [1 ]
机构：
[1] HeNan Polytech Univ, Sch Mech & Power Engn, 2001 ShiJi Rd, Jiaozuo, Henan, Peoples R China
[2] HeNan YOUK Elect Mat Co LTD, High Tech Pk, Jiyuan, Peoples R China
来源：
2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC) | 2018年
关键词：
Silver alloy bonding wire; Ti; Y; Free air ball; Reliability; PCT; COPPER WIRE; AIR;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the study, bonded strength and reliability under high temperature and humid environment for silver alloy bonding wire were investigated. It was found that Ti (0.05%wt) and Y (0.05%wt) doped in the Ag-4.5%Pd alloy bonding wire could form substitutional solid solution with Ag, those did not cause golf ball defects. Minute quantities Ti and Y can refine the grain size, form uniform structure, improve the mechanical properties and bonded strength, and the reliability was improved. After PCT test, cracks were not found in the bonding interface, the ball shear strength and ball pull force of silver alloy wire decreased, and the reliability is better after doping some Ti and Y.
引用
收藏
页码：341 / 345
页数：5
相关论文
共 50 条
  • [41] Reliability of Circuits Under Pads for Au and Cu Wire Bonding
    Gambino, J. P.
    Malinowski, J.
    Cote, A.
    Guthrie, B.
    Chapman, P.
    Vize, A.
    Bowe, W.
    Griffin, C.
    Cooney, E.
    Aoki, T.
    Chen, Y.
    Wang, D.
    Jaffe, M.
    2012 19TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2012,
  • [42] The Analysis of Wire Bonding Reliability under Critical Operating Conditions
    Buran, Martin
    Reznicek, Michal
    Vlasaty, Andrej
    2020 43RD INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2020,
  • [43] BONDING STRENGTH OF ALUMINA JOINT BONDED UNDER THE ALTERNATING STRESS
    SASAKI, K
    MOTOIE, K
    KAWASAKI, T
    NIPPON SERAMIKKUSU KYOKAI GAKUJUTSU RONBUNSHI-JOURNAL OF THE CERAMIC SOCIETY OF JAPAN, 1993, 101 (02): : 159 - 163
  • [44] Wire bonding technique for high temperature applications
    Freytag, J
    Wennemuth, I
    1998 5TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY PROCEEDINGS, 1998, : 219 - 221
  • [45] Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device
    Yamada, Y.
    Takaku, Y.
    Yagi, Y.
    Nakagawa, I.
    Atsumi, T.
    Shirai, M.
    Ohnuma, I.
    Ishida, K.
    MICROELECTRONICS RELIABILITY, 2007, 47 (12) : 2147 - 2151
  • [46] The development of the high strength aluminum alloy wire
    Yoshida, Sho
    Sekiya, Shigeki
    Mitose, Kengo
    Furukawa Review, 2018, (49): : 16 - 22
  • [47] HIGH-STRENGTH, LOW-TEMPERATURE BONDING WITH SILVER-TIN SOLDERS
    DAVIES, RL
    WELDING JOURNAL, 1976, 55 (10) : 838 - 842
  • [48] High-Reliability Bonding by Nano-Silver Paste with Tin Addition for High Temperature Electronic
    Liu, Jiaxin
    Peng, Yang
    Lei, Zhenyu
    Mou, Yun
    Chen, Mingxiang
    2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
  • [49] Fatigue Performance of Butt Welds of High Strength Steel under the Humid and Hot Immersion Environment
    Guo H.
    Cai X.
    Li G.
    Wang Y.
    Liu Y.
    Jianzhu Cailiao Xuebao/Journal of Building Materials, 2022, 25 (08): : 823 - 829
  • [50] Cu wire stitch bond reliability study under high temperature storage
    Miao, Wang
    2015 IEEE 17TH ELECTRONICS PACKAGING AND TECHNOLOGY CONFERENCE (EPTC), 2015,
12345