Multiscale coupling using a finite element framework at finite temperature

被引:15
|
作者
Iacobellis, Vincent [1 ]
Behdinan, Kamran [1 ]
机构
[1] Univ Toronto, Fac Appl Sci & Engn, Dept Mech & Ind Engn, Toronto, ON M5S 3G8, Canada
基金
欧盟地平线“2020”;
关键词
multiscale; finite element methods; molecular mechanics; fracture; nanomechanics; MOLECULAR-DYNAMICS; CRACK-PROPAGATION; LENGTH SCALES; VOID GROWTH; CONTINUUM; SIMULATION; MECHANICS; FRACTURE; COPPER; MODEL;
D O I
10.1002/nme.4355
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper presents the formulation and application of a multiscale methodology that couples three domains using a finite element framework. The proposed method efficiently models atomistic systems by decomposing the system into continuum, bridging, and atomistic domains. The atomistic and bridging domains are solved using a combined finite elementmolecular mechanics simulation where the system is discretized into atom/nodal centric elements based on the atomic scale finite element method. Coupling between the atomistic domain and continuum domain is performed through the bridging cells, which contain locally formulated atoms whose displacements are mapped to the nodes of the bridging cell elements. The method implements a temperature-dependent potential for finite temperature simulations. Validation and demonstration of the methodology are provided through three case studies: displacement in a one-dimensional chain, stress around nanoscale voids, and fracture. From these studies differences between multiscale and fully atomistic simulations were very small with the simulation time of the proposed methodology being approximately a tenth of the time of the fully atomistic model. Copyright (C) 2012 John Wiley & Sons, Ltd.
引用
收藏
页码:652 / 670
页数:19
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