Challenges in 3D Integration Due to Differences in Silicon and System Design Environments

被引：0

作者：

Yip, Tsunwai Gary ^{[1
]}

Lau, Benedict ^{[1
]}

Seeker, David ^{[1
]}

Louis-Chandran, Joe ^{[1
]}

Ji, Mandy ^{[1
]}

机构：

[1] Rambus Inc, Sunnyvale, CA 94089 USA

来源：

2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Interests in advancing 3D design and integration have stimulated this study of connecting two different silicon dies using an organic interposer. This paper reports some of the challenges encountered by the system and silicon designers during the process of 3D integration. The discussion focuses on ways to improve the efficiency of the design flow, integration and verification of a 3D configuration. By considering the strength and weakness of the silicon and system design environments, the two were used in a complementary manner to achieve the 3D integrated design.

引用

页码：23 / 26

页数：4

共 50 条

[1] Reshaping System Design in 3D Integration: Perspectives and Challenges
Chen, Hung-Ming
Ho, Chu-Wen
Wu, Shih-Hsien
Lu, Wei
Huang, Po-Tsang
Chang, Hao-Ju
Liu, Chien-Nan Jimmy
PROCEEDINGS OF THE 2023 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, ISPD 2023, 2023, : 71 - 77
[2] 3D Integration: Opportunities, Design Challenges and Approaches
Knoechel, Uwe
2012 IEEE 15TH INTERNATIONAL SYMPOSIUM ON DESIGN AND DIAGNOSTICS OF ELECTRONIC CIRCUITS & SYSTEMS (DDECS), 2012, : 4 - 4
[3] Challenges in 3D Integration
Koyanagi, Mitsumasa
Lee, Kang Wook
Fukushima, Takafumi
Tanaka, Tetsu
SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 3, 2013, 53 (03): : 237 - 244
[4] 3D silicon integration
Knickerbocker, J. U.
Andry, P. S.
Dang, B.
Horton, R. R.
Patel, C. S.
Polastre, R. J.
Sakuma, K.
Sprogis, E. S.
Tsang, C. K.
Webb, B. C.
Wright, S. L.
58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 538 - +
[5] CFET Design Options, Challenges, and Opportunities for 3D Integration
Liebmann, L.
Smith, J.
Chanemougame, D.
Gutwin, P.
2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2021,
[6] 3D Integration for Energy Efficient System Design
Borkar, Shekhar
2009 SYMPOSIUM ON VLSI TECHNOLOGY, DIGEST OF TECHNICAL PAPERS, 2009, : 58 - 59
[7] 3D Integration for Energy Efficient System Design
Borkar, Shekhar
PROCEEDINGS OF THE 48TH ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2011, : 214 - 219
[8] Physical Design for 3D Chiplets and System Integration
Hou, Cliff
PROCEEDINGS OF THE 2020 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN (ISPD'20), 2020, : 73 - 73
[9] Implementation challenges of annotated 3D models in collaborative design environments
Engineering Design Graphics, Texas A and M University, College Station
TX, United States
不详
不详
Lect. Notes Comput. Sci., (222-229):
[10] Implementation Challenges of Annotated 3D Models in Collaborative Design Environments
Camba, Jorge
Contero, Manuel
Salvador-Herranz, Gustavo
COOPERATIVE DESIGN, VISUALIZATION, AND ENGINEERING, CDVE 2014, 2014, 8683 : 222 - 229

← 1 2 3 4 5 →