Challenges in 3D Integration Due to Differences in Silicon and System Design Environments

被引：0
|
作者：
Yip, Tsunwai Gary [1 ]
Lau, Benedict [1 ]
Seeker, David [1 ]
Louis-Chandran, Joe [1 ]
Ji, Mandy [1 ]
机构：
[1] Rambus Inc, Sunnyvale, CA 94089 USA
来源：
2011 12TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY AND HIGH DENSITY PACKAGING (ICEPT-HDP) | 2011年
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暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Interests in advancing 3D design and integration have stimulated this study of connecting two different silicon dies using an organic interposer. This paper reports some of the challenges encountered by the system and silicon designers during the process of 3D integration. The discussion focuses on ways to improve the efficiency of the design flow, integration and verification of a 3D configuration. By considering the strength and weakness of the silicon and system design environments, the two were used in a complementary manner to achieve the 3D integrated design.
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页码：23 / 26
页数：4
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