Adhesion mechanism of copper films deposited by magnetron sputtering on polyamide composites

被引：0
|
作者：
Legois, V [1 ]
Aucouturier, M [1 ]
Ollivier, E [1 ]
Darque-Ceretti, E [1 ]
Macheto, P [1 ]
机构：
[1] Univ Paris Sud, Met Lab, URA CNRS 1107, F-91405 Orsay, France
来源：
SURFACE MODIFICATION TECHNOLOGIES XI | 1998年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This paper presents the study of the interface between copper and a glass fibre reinforced PAMXD 6 polymer. Substrate surface chemistry was characterised prior to metallization, by spectroscopic techniques (XPS, FTIR). Chemical bonding of copper layers (20 nm to 2 mu m thick) to the polymer was investigated by SPS (depth profiling, argon ion bombardment) and SIMS. The results showed that copper reacts with the polymer, leading to the formation of an interfacial compound probably like Cu-O-C, and illustrated the influence of the evaporation pressure and temperature parameters on the interfacial structure and final quality of the film. The adherence strength of the coating, obtained by Z-axis tensile tests (studs bonded to the PAMXD 6 with an epoxy glue), confirmed the interpretation of the analyses.
引用
收藏
页码：101 / 112
页数：12
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