Techniques for Improving System-in-Package Integration and Electrical Performance

In this paper, we use bond-via-arr ayn4 (BVA) wirebonds to achieve compact vertical integration and improve the electrical performance of system-in-package (SiP) modules. Two improvements are presented. First, BVA wirebonds are utilized to integrate passive or active components vertically with other components. This significantly reduces the horizontal footprint of the entire SiP. In terms of electrical performance, this vertical integration provides much lower parasitic inductance than conventional 2D horizontal integration designs because of shorter interconnections. For example, the proposed technology can significantly reduce power delivery network (PDN) impedance compared to a conventional design. Second, we propose BVA wirebond wires as an electromagnetic interference (EMI) shield between different domains within the SiP. This provides a lower cost solution for EMI shielding, particularly when regions within a package need to be shielded.