Preparation of single-oriented (111)Vn film with low-resistivity and its application as diffusion barrier between Cu and Si

被引:7
|
作者
Yoshimoto, K
Kaiya, F
Shinkai, S
Sasaki, K
Yanagisawa, H
机构
[1] Asahikawa Natl Coll Technol, Dept Elect & Comp Engn, Asahikawa, Hokkaido 0718142, Japan
[2] Takuma Natl Coll Technol, Dept Control Engn, Kagawa 7691192, Japan
[3] Kitami Inst Technol, Fac Engn, Dept Mat Sci, Kitami, Hokkaido 0908507, Japan
[4] Kitami Inst Technol, Fac Engn, Dept Elect & Elect Engn, Kitami, Hokkaido 0908507, Japan
关键词
LSI contact structure; Cu metallization; diffusion barrier; low-resistivity (111)VN film; single-oriented growth; metal/semiconductor interface;
D O I
10.1143/JJAP.45.215
中图分类号
O59 [应用物理学];
学科分类号
摘要
We have investigated the Optimum conditions for preparing single-oriented (111)VN film with low-resistivity by reactive sputtering and prepared a Cu/VN/Si contact system to apply the (111)VN film as a diffusion barrier used in the Cu metallization technology of Si-LSI. Then, influences of various sputtering conditions on the film quality of VN were investigated, and the thermal stability of the contact system was evaluated by X-ray diffraction (XRD) and Auger electron spectroscopy (AES) analyses. As a result, it is revealed that a nearly stoichiometric single-oriented (111)VN film with a resistivity of 57 mu Omega cm can be prepared under the optimum sputtering conditions, and the Cu/VN/Si contact system is satisfactorily stable up to 700 degrees C, even when the thickness of the VN diffusion barrier is reduced to 30nm..
引用
收藏
页码:215 / 220
页数:6
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