共 50 条
- [42] SoIC for Low-Temperature, Multi-Layer 3D Memory Integration 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 855 - 860
- [43] Modeling of Multi-Layer Enclosing Structures of Anechoic Chambers for Research of Electromagnetic Radiation of Equipment PROCEEDINGS OF THE 2018 IEEE CONFERENCE OF RUSSIAN YOUNG RESEARCHERS IN ELECTRICAL AND ELECTRONIC ENGINEERING (EICONRUS), 2018, : 1651 - 1655
- [45] 1D modeling of multi-layer piezoelectric transformers PESC 2001: 32ND ANNUAL POWER ELECTRONICS SPECIALISTS CONFERENCE, VOLS 1-4, CONFERENCE PROCEEDINGS, 2001, : 2097 - 2102
- [47] 3D Memory Chip Stacking by Multi-Layer Self-Assembly Technology 2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2013,
- [48] An Analytical Method for Rendering Plenoptic Cameras 2.0 on 3D Multi-layer Displays MULTIMEDIA MODELING, MMM 2025, PT I, 2025, 15520 : 101 - 110