A review on GaN HEMTs: nonlinear mechanisms and improvement methods

被引:12
|
作者
Du, Chenglin [1 ,2 ]
Ye, Ran [1 ,2 ]
Cai, Xiaolong [1 ,2 ]
Duan, Xiangyang [1 ,2 ]
Liu, Haijun [2 ]
Zhang, Yu [2 ]
Qiu, Gang [2 ]
Mi, Minhan [3 ]
机构
[1] State Key Lab Mobile Network & Mobile Multimedia T, Shenzhen 518055, Peoples R China
[2] ZTE Corp, Wireless Prod Planning Dept, Shenzhen 518055, Peoples R China
[3] Xidian Univ, Sch Microelect, Xian 710071, Peoples R China
基金
中国国家自然科学基金;
关键词
GaN HEMT; linearity improvement; transconductance reduction; transconductance compensation; nanowire channel; graded channel; ELECTRON-MOBILITY TRANSISTORS; FIELD-EFFECT TRANSISTORS; ON-SI HEMTS; SURFACE PASSIVATION; ALGAN/GAN HEMTS; CURRENT COLLAPSE; IMPROVED LINEARITY; ACCESS RESISTANCE; FREQUENCY DISPERSION; TRANSIENT-RESPONSE;
D O I
10.1088/1674-4926/44/12/121801
中图分类号
O469 [凝聚态物理学];
学科分类号
070205 ;
摘要
The GaN HEMT is a potential candidate for RF applications due to the high frequency and large power handling capability. To ensure the quality of the communication signal, linearity is a key parameter during the system design. However, the GaN HEMT usually suffers from the nonlinearity problems induced by the nonlinear parasitic capacitance, transconductance, channel transconductance etc. Among them, the transconductance reduction is the main contributor for the nonlinearity and is mostly attributed to the scattering effect, the increasing resistance of access region, the self-heating effect and the trapping effects. Based on the mechanisms, device-level improvement methods of transconductance including the trapping suppression, the nanowire channel, the graded channel, the double channel, the transconductance compensation and the new material structures have been proposed recently. The features of each method are reviewed and compared to provide an overview perspective on the linearity of the GaN HEMT at the device level.
引用
收藏
页数:16
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