Heterogeneous Integration with 3D Chiplets

被引：0
|
作者：
Kulkarni, Deepak [1 ]
机构：
[1] AMD Inc, Santa Clara, CA 95054 USA
来源：
2023 INTERNATIONAL VLSI SYMPOSIUM ON TECHNOLOGY, SYSTEMS AND APPLICATIONS, VLSI-TSA/VLSI-DAT | 2023年
关键词：
D O I：
10.1109/VLSI-TSA/VLSI-DAT57221.2023.10134194
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：1
相关论文
共 50 条
  • [21] Heterogeneous Integration of Chiplets: Cost and Yield Tradeoff Analysis
    Ahmad, Mudasir
    Delacruz, Javi
    Ramamurthy, Anu
    2022 23RD INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2022,
  • [22] 3D Heterogeneous System Integration: Application Driver for 3D Technology Development
    Beyne, Eric
    Marchal, Pol
    Van Der Plas, Geert
    PROCEEDINGS OF THE 48TH ACM/EDAC/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2011, : 213 - 213
  • [23] 3D Advanced Integration Technology for Heterogeneous Systems
    Vivet, Pascal
    Bernard, Christian
    Clermidy, Fabien
    Dutoit, Denis
    Guthmuller, Eric
    Panades, Ivan-Miro
    Pillonnet, G.
    Thonnart, Yvain
    Garnier, Arnaud
    Lattard, Didier
    Jouve, Amandine
    Bana, Franck
    Mourier, Thierry
    Cheramy, Severine
    2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,
  • [24] 3D Stacking Heterogeneous Integration for Devices and Modules
    Sun, X.
    De De Raedt, W.
    Beyne, E.
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012), 2012, 44 (01): : 721 - 726
  • [25] Heterogeneous Integration toward Monolithic 3D Chip
    Kim, SangHyeon
    Kim, Seong-Kwang
    Shim, Jae-Phil
    Geum, Dae-myeong
    Ju, Gunwu
    Kim, Han Sung
    Lim, Hee Jung
    Lim, Hyeong Rak
    Han, Jae-Hoon
    Kang, ChangMo
    Lee, Dong Seon
    Song, Jin Dong
    Choi, Won Jun
    Kim, Hyung-jun
    2017 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2017,
  • [26] Security Advantages and Challenges of 3D Heterogeneous Integration
    Liu, Yuntao
    Xing, Daniel
    Mcdaniel, Isaac
    Ozbay, Olsan
    Akib, Abir
    Sukanya, Mumtahina Islam
    Rekhi, Sanjay
    Srivastava, Ankur
    COMPUTER, 2024, 57 (03) : 107 - 112
  • [27] Technologies for 3D Wafer Level Heterogeneous Integration
    Wolf, M. J.
    Ramm, P.
    Klumpp, A.
    Reichl, H.
    DTIP 2008: SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS, 2008, : 123 - +
  • [28] Opportunities for 2.5/3D Heterogeneous SoC Integration
    Jiang, Iris Hui-Ru
    Chang, Yao-Wen
    Huang, Jilin-Lang
    Chen, Chung-Ping
    2021 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2021,
  • [29] A Modularized 3D Heterogeneous System Integration Platform
    Huang, Chun-Ming
    Yang, Chih-Chyau
    Wu, Chien-Ming
    Lin, Chih-Hsing
    Chiu, Chun-Chieh
    Liu, Yi-Jun
    Chu, Chun-Chieh
    Chang, Nien-Hsiang
    Chen, Wen-Ching
    2012 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS (APCCAS), 2012, : 396 - 399
  • [30] 3D Heterogeneous Integration Technology for AI System
    Koyanagi, Mitsumasa
    2020 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), 2020,
12345