共 50 条
- [1] Unified Redistribution Layer Routing for 2.5D IC Packages 2020 25TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE, ASP-DAC 2020, 2020, : 331 - 337
- [2] Wafer Level Reliability Characterization of 2.5D IC packages 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2018, : 274 - 277
- [3] Joule heating enhanced electromigration failure in redistribution layer in 2.5D IC 2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 1359 - 1363
- [5] Assesment of CPI stress impact on IC reliability and performance in 2.5D/3D packages 2019 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2019,
- [6] An Any-Angle Routing Method using Quasi-Newton Method 2012 17TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC), 2012, : 145 - 150
- [7] Deformation Prediction of 2.5D IC Package 2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016), 2016, : 301 - 305
- [8] TSV Technology for 2.5D IC Solution 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 284 - 288
- [9] An Acceleration for Any-Angle Routing using Quasi-Newton Method on GPGPU 2014 IEEE 8TH INTERNATIONAL SYMPOSIUM ON EMBEDDED MULTICORE/MANYCORE SOCS (MCSOC), 2014, : 281 - 288