共 50 条
- [41] Flexible Interconnect in 2.5D ICs to Minimize the Interposer's Metal Layers 2017 22ND ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC), 2017, : 372 - 377
- [43] Turtle Base with Fin Perforated Heat Exchangers for the 2.5D and 3D IC Structures 2017 12TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2017, : 97 - 101
- [44] Signal-Integrity-Aware Interposer Bus Routing in 2.5D Heterogeneous Integration 27TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE, ASP-DAC 2022, 2022, : 178 - 183
- [45] Polymer-based Fine Pitch Cu RDL to Enable Cost-Effective Re-routing for 2.5D Interposer and 3D-IC PROCEEDINGS OF THE 2013 IEEE 15TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2013), 2013, : 435 - 439
- [46] Study of Phase Shift of Lock-In Thermography and Its Application in 2.5D IC Package 2018 25TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2018,
- [47] Investigation of Moisture-Induced Warpage of Chip-on-Wafer in 2.5D IC Package IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1095 - 1102
- [48] Precise RLGC Modeling and Analysis of Through Glass Via (TGV) for 2.5D/3D IC 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 254 - 259
- [49] Quantitative comparison of 3D and 2.5D gamma analysis: introducing gamma angle histograms PHYSICS IN MEDICINE AND BIOLOGY, 2013, 58 (08): : 2597 - 2608
- [50] Micro-bump Bondability Design Guidelines for High Throughput 2.5D & 3D IC Assemblies 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 897 - 903