3D Heterogeneous Integration (3DHI): An Enabler For Next Generation RF Systems

To perform increasingly diverse missions in increasingly crowded electromagnetic (EM) environments, future sensor and communication systems will require increased bandwidth, sensitivity and enhanced functionality per unit area. These needs are driving sensor arrays towards higher levels of integration of a diverse set of materials, devices and components across multiple domains. This includes 3D solutions, particularly at millimeter wave and THz frequencies. This talk will present an overview of the evolution of heterogenous integration programs at DARPA and potential paths forward, including innovations in millimeter wave components and architectures being developed in the ELectronics for G-band ARrays (ELGAR) program, thermal management of high-power density and 3D electronics (THREADS and MiniTherms3D) and 3DHI at the transistor level being explored under the Heterogeneous Heterostructures (H2) and related programs.