共 50 条
- [41] Trends and Future Challenges of 3D NAND Flash Memory 2023 IEEE INTERNATIONAL MEMORY WORKSHOP, IMW, 2023, : 9 - 12
- [44] WAFER THINNING AND DICING TECHNOLOGY FOR 3D NAND FLASH 2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2019,
- [45] A 3D Tensor Representation of Speech and 3D Convolutional Neural Network for Emotion Recognition Circuits, Systems, and Signal Processing, 2023, 42 : 4271 - 4291
- [47] Study on cell shape in 3D NAND flash memory PROCEEDINGS OF THE 2015 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2015, : 387 - 390
- [50] Device Characteristics of Single-Gate Vertical Channel (SGVC) 3D NAND Flash Architecture 2016 IEEE 8TH INTERNATIONAL MEMORY WORKSHOP (IMW), 2016,