3Dblox: Unleash the Ultimate 3DIC Design Productivity

被引：0
|
作者：
Chang, Jim [1 ]
机构：
[1] TSMC, 3DIC Design Methodol, Hsinchu, Taiwan
来源：
PROCEEDINGS OF THE 2024 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, ISPD 2024 | 2024年
关键词：
3D IC; Advanced packaging; Performance;
D O I：
10.1145/3626184.3635286
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：215 / 215
页数：1
相关论文
共 50 条
  • [1] Applications and Design Styles for 3DIC
    Franzon, Paul D.
    Rotenberg, Eric
    Tuck, James
    Davis, W. Rhett
    Zhou, Huiyang
    Schabel, Joshua
    Zhang, Zhenquian
    Park, J.
    Dwiel, Brandon
    Forbes, Elliott
    JoonmooHuh
    Priyadarshi, Shivam
    Lipa, Steve
    Thorolfsson, Thor
    2013 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2013,
  • [2] Exploring Early Design Tradeoffs in 3DIC
    Franzon, Paul D.
    Priyadarshi, Shivam
    Lipa, Steve
    Davis, W. Rhett
    Thorolfsson, Thor
    2013 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2013, : 545 - 549
  • [3] Design Review on Capacitive Coupling Interconnect for 3DIC
    Myat Thu Linn Aung
    Lim, Eric
    Yoshikawa, Takefumi
    Kim, Tony Tae-Hyoung
    PROCEEDINGS OF THE 2015 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2015, : 245 - 248
  • [4] Welcome to 3DIC 2023
    O'Mathuna, Cian
    O'Brien, Peter
    Nagaraja, Veda Sandeep
    3DIC 2023 - IEEE International 3D Systems Integration Conference, 2023,
  • [5] 3DIC Design Challenges, Early Solutions and Future Recommendations
    Kolesov, Victoria
    Rajan, Vivek
    Nagisetty, Ramune
    2021 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE (CICC), 2021,
  • [6] Opportunities, Challenges and Mitigations in 3DIC Design, Test, and Analyses
    Kamal, Pratyush
    Mastroianni, Anthony
    Rey, Juan
    de la Serna, Antonio
    2024 IEEE 67TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, MWSCAS 2024, 2024, : 867 - 869
  • [7] Progress in 3DIC SEMI standards
    Garrou, Phil
    SOLID STATE TECHNOLOGY, 2012, 55 (08) : 11 - 11
  • [8] 基于HITOC DK与3DIC Integrity的3DIC芯片物理设计
    徐睿
    王贻源
    电子技术应用, 2022, 48 (08) : 55 - 59
  • [9] 3DIC from Concept to Reality
    Lee, Frank
    Shen, Bill
    Chen, Willy
    Lee, Suk
    2013 18TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC), 2013, : 394 - 398
  • [10] 3DIC Design: Challenges and Opportunities in System-of-Chips Integration
    Zhang, Ming
    ISPD'22: PROCEEDINGS OF THE 2022 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, 2022, : 81 - 81
12345