3Dblox: Unleash the Ultimate 3DIC Design Productivity

被引：0
|
作者：
Chang, Jim [1 ]
机构：
[1] TSMC, 3DIC Design Methodol, Hsinchu, Taiwan
来源：
PROCEEDINGS OF THE 2024 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, ISPD 2024 | 2024年
关键词：
3D IC; Advanced packaging; Performance;
D O I：
10.1145/3626184.3635286
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：215 / 215
页数：1
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