Glass Binding for Nanocomposite Materials for Thick-Film Hybrid Integrated Circuits

被引：0
|
作者：
Lepikh, Ya. I. [1 ]
Borshchak, V. A. [1 ]
Sadova, N. N. [1 ]
Zatovskaya, N. P. [1 ]
机构：
[1] Odesa II Mechnikov Natl Univ, 2 Dvoryanska Str, UA-65082 Odesa, Ukraine
来源：
NANOMATERIALS AND NANOCOMPOSITES, NANOSTRUCTURE SURFACES, AND THEIR APPLICATIONS, NANO2021 | 2023年 / 279卷
关键词：
D O I：
10.1007/978-3-031-18096-5_31
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Modern multilevel hybrid integrated circuits (HIC) and microelectronic sensors are widely used as thick-film elements dispersed composites based on << glassmetal compounds >>, which are a multiphase heterogeneous system consisting of powder functional material, glass powders, and organic compounds and are formed by annealing. The composite formation is accompanied by complex physical and chemical processes between the conductive phase, on the one hand, and the glass component, on the other hand, and determine, under the selected annealingmodes, the phase composition, microstructure, and electrophysical parameters of the obtained nanocomposites.
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页码：531 / 536
页数：6
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