Characterization of Cu3P phase in Sn3.0Ag0.5Cu0.5P/Cu solder joints

被引：0
|
作者：
Jian-xun Chen [1 ]
Xing-ke Zhao [1 ]
Xu-chen Zou [1 ]
Ji-hua Huang [1 ]
Hai-chun Hu [1 ]
Hai-lian Luo [1 ]
机构：
[1] School of Materials Science and Engineering,University of Science and Technology Beijing
来源：
InternationalJournalofMineralsMetallurgyandMaterials | 2014年 / 21卷 / 01期
关键词：
lead-free solders; phosphorus; melting temperature; microstructure; thermodynamics;
D O I：
暂无
中图分类号：
TG407 [焊接接头的力学性能及其强度计算];
学科分类号：
摘要：
This article reports the effects of phosphorus addition on the melting behavior,microstructure,and mechanical properties of Sn3.0Ag0.5Cu solder.The melting behavior of the solder alloys was determined by differential scanning calorimetry.The interfacial microstructure and phase composition of solder/Cu joints were studied by scanning electron microscopy and energy dispersive spectrometry.Thermodynamics of Cu-P phase formation at the interface between Sn3.0Ag0.5Cu0.5P solder and the Cu substrate was characterized.The results indicate that P addition into Sn3.0Ag0.5Cu solder can change the microstructure and cause the appearance of rod-like Cu3P phase which is distributed randomly in the solder bulk.The Sn3.0Ag0.5Cu0.5P joint shows a mixture of ductile and brittle fracture after shear testing.Meanwhile,the solidus temperature of Sn3.0Ag0.5Cu solder is slightly enhanced with P addition.
引用
收藏
页码：65 / 70
页数：6
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